OSAKA, JAPAN — Jun 2012 —

When reflowed with SN100C P810 D4 large-area solder joints such as those between power semiconductors and their substrates have a lower incidence of voiding than if reflowed with conventional lead-free solder paste. While delivering low voiding this high reliability lead-free solder paste is also formulated to deliver excellent reflow with minimum mid-chip balling and exhibits excellent wetting on all common substrates. Our test results indicate that when used in combination with vacuum reflow this paste can produce solder joints on 19x19mm pads and joints to power transistors with less than 1% voiding.

SN100C P810 D4 is based on Nihon Superior’s well known silver-free and lead-free solder alloy SN100C®, which has a track record of more than 13 years of successful delivery of high productivity and high reliability. SN100C is a compliant alloy with high impact strength and has a cost advantage over alloys containing silver. It can be reflowed with profiles similar to those commonly used with alloys such as SAC305 and SAC405.

【Features】

• Reducing voiding
• Minimum incidence of mid-chip balling
• Excellent wetting behavior

【Properties】

• Alloy composition: SN100C(Sn-0.7Cu-0.05Ni+Ge)
• Melting point: 227℃
• Flux content: 11.5mass%
• Spread factor: 75%