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2012.1.10SN100C Advantage Series® Lead-Free Solder Sphere SN99CN and Paste SN99CN P502 D4

For Immediately Release

Ag addition for strength and stable intermetallic in reflowed BGA spheres

OSAKA, Japan- January 10, 2012- Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, introduces the SN100C Advantage Series®, New Products, Lead-Free Solder Sphere SN99CN and Paste SN99CN P502 D4 which will be exhibited as Implementing Lead-Free Soldering with Cost Reduction AND Reliability together with SN100C® at INTERNEPCON JAPAN 2012 held in Tokyo Big Sight from January 18 to 20 (Booth No. East 13-30, East Hall 6).

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Lead-Free SN100C Advantage Series® Solders:  SN99CN spheres and SN99CN P502 D4 solder paste Ag addition for strength and stable intermetallic.

With a controlled addition of Ag, SN99CN is the first of Nihon Superior’s new SN100C Advantage Series®.  In high speed pull testing of joints reflowed to a copper substrate it ranking in comparison with other common alloys in terms of fracture energy at pull speeds≥10mm/s is: SN99CN>SN100C≥Sn-37Pb>Sn-3.0Ag-0.5Cu.

◆Pull Impact Test Results

 

Results indicate the ranking of fracture energy at pull speeds≥10mm/sec. 
1.SN99CN>2.SN100C≥3.Sn-37Pb>4.Sn-3.0Ag-0.5Cu

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◆Cross Section of Solder Spheres after Ageing
Both SN100C and SN99CN form a uniform interfacial IMC and which grows more slowly than that in Sn-3.0Ag-0.5Cu.
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【Material Comparison】
 Solder Sphere Diameter : 0.5mm
  ・SN100C  (Sn-0.7Cu-0.05Ni+Ge)
  ・SN99CN (Sn-1.1Ag-0.7Cu-0.05Ni+α)
  ・Sn-3.0Ag-0.5Cu

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Lead-free Solder SN100C (Sn-0.7Cu-0.05Ni+Ge) forms a stable slow-growing Ni-stabilized intermetallic compound layer (CuxNiySnz) at the interface with both Cu-OSP and ENIG substrates. The SN100C Advantage Series includes products with additional properties.

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※SN99CN is patent pending
 

<Related information>

 ・2012.01.10 Topics Nihon Superior Highlights IMC Differences between Low-Ag and No-Ag Lead-Free Solders
 ・2011.12.13 Topics Implementing Lead-Free Soldering with Cost Reduction AND Reliability
 ・2011.11.08 Topics
    Nihon Superior Highlights Copper Erosion Differences between Low-Ag and No-Ag Lead-Free Solders
 
【Contact 】
Nihon Superior Co., Ltd. Overseas Sales Section
TEL : +81-6-6380-1121 E-Mail: info@nihonsuperior.co.jp


 
 

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