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2010.7.13Nihon Superior Wins ICEP Outstanding Paper Award！
Academic Research Paper Explains the Reliability of SN100C
Nihon Superior is pleased to annouce that research they have sponsored at the University of Queensland, Australia, has provided the basis for the paper that earned an ICEP Outstanding Paper Award. The Award, presented during the opening ceremony of ICEP 2010 in Sapporo on May 12, was for the paper, “Inhibiting Cracking of Interfacial Cu6Sn5 by Ni Additions to Sn-based Lead-free Solders” that was presented by the lead author, The University of Queensland's Associate Professor Kazuhiro Nogita, at ICEP 2009 in Kyoto. The paper, which reports a phenomenon that explains a major contribution to the reliability of Nihon Superior’s SN100C® solder alloy was co-authored by Stuart McDonald, Hideaki Tsukamoto and Jonathan Read of University of Queensland and the president of Nihon Superior, Tetsuro Nishimura and Shoichi Suenaga of Nihon Superior.
＜Aｂｓｔract＞
The Authors have successfully developed a method of limiting cracking in the Cu6Sn5 intermetallic compounds, which are formed at the interface between lead free solders and their Cu substrates. In this paper, it is shown that the level of cracking in the (Cu,Ni)6Sn5reaction layer and the morphology of the intermatallics varies with the Ni content. To explore the mechanisms associated with the differences in joint integrity, detailed synchrotron X-ray powder diffraction (XRD) has been used with Rietveld analysis. The results show Ni stabilises a high temperature allotrope of the Cu6Sn5 phase avoiding stresses induced by a volumetric change that would otherwise occur on phase transformation..
The paper can be found under “Technical Information”
on Nihon Superior’s website, http://www.nihonsuperior.co.jp
Inhibition Cracking of Interfacial Cu6Sn5 by Ni Additions to Sn-basesed Lead-Free Solder
【Contact】
Nihon Superior’s Overseas Customer Service
E-Mailinfo@nihonsuperior.co.jp TEL：+81-(0)6-6380-1143
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