2010.3.9Nihon Superior to Exhibit at APEX 2010

Highlight a Complete Suite of SN100C Soldering Materials at APEX 2010

Nihon Superior Co. Ltd., is pleased to announce that it will display a full range of products based on its unique lead-free solder SN100C in booth 1426 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas, NV. This will include the company’s completely Halogen-Free Solder Paste, SN100C P602 D4. Also, to showcase the versatility of SN100C, the company will display a range of production boards soldered with SN100C. A highlight of this new range is the halogen-free solder paste and flux cored wire that include no halogens, fluorine (F), chlorine (Cl), bromine (Br) or iodine (I) in their formulation, while still delivering excellent wetting on all substrates. Solutions for Tin Whiskers Due To Corrosion: Completely Halogen-free Lead-free Flux-Cored Solder Wire SN100C(040) No whiskers were observed as a result of testing for 1,000 hour exposure under the condition of 85C/85% temperature and humidity. SN100C(040) Halogen-free flux cored wire is an effective solution in preventing whiskers due to corrosion of the solder surface. (Different formulations of so-called halogen-free fluxes on various board finishes still need to be carefully examined for the possible incidence of whiskers.) SN100C(040)   New Product:Completely Halogen-Free SN100C P602 D4 Solder Paste SN100C 602 D4 is a high activity, halogen-free, lead-free solder paste with excellent fillet formation at the exposed ends of the lead terminations.   SN100C P602 D4 For further information about any of the above products, please visit the Nihon Superior’s booth at APEX. 【Contact】 Nihon Superior’s Overseas Customer Service E-Mail：info@nihonsuperior.co.jp　TEL：+81-(0)6-6380-1143