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2010.2.10Nihon Superior’s Keith Sweatman to Present at TMS 2010
February 18, 2010 from 8:30-11:45 a.m. at the Washington State Convention Center
Nihon Superior Co. Ltd., announces that Keith Sweatman will present a paper titled “The Relationship between Whisker Growth and Corrosion in Sn-3.0Ag-0.5Cu” at the upcoming TMS 2010 Annual Meeting & Exhibition, scheduled to take place February 14-18, 2010 at the Washington State Convention Center in Seattle.
The presentation will be held during session titled “Pb-Free Solders and Emerging Interconnect and Packaging Technologies: Microstructure, Intermetallics, Whisker (II)”, which is scheduled to take place Thursday, February 18, 2010 from 8:30-11:45 a.m.
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| Mr. Keith Sweatman |
Since the electronics industry moved to lead-free solders that typically have a tin content of more than 95 percent there has been concern about the possibility of circuit malfunctions due to whisker growth. It is now generally accepted that whisker growth is a response to compressive stress within the tin crystal and the challenge is to identify and eliminate or at least minimize the processes that can generate such stress.
Corrosion has been identified as one source of that stress and in this paper the authors report a study directed at identifying the relationship between the extent of corrosion and the concomitant whisker growth. Printed circuit coupons with an OSP finish were soldered with SAC305 solder using wave, reflow, and hand soldering methods with flux formulations typical of current commercial practice.
【Contact】
Nihon Superior’s Overseas Customer Service
E-Mail：info@nihonsuperior.co.jp TEL：+81-(0)6-6380-1143
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