| Announced in 2012 |
Pan Pacific Microelectronics Symposium
（Kauai, Hawaii 14 - 16 Feb 2012）
As originally published in the Pan Pacific Microelectronics Symposium 2012 Conference Programs
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Pushing the Limits of Lead-Free Soldering |
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| The Stability of Cu6Sn5 in the Formation and Performance of Lead-free Solder Joints |
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| Tin-Copper-Nickel-Germanium, A Case Study in Lead-Free Implementation |
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| Announced in 2011 |
SMTAI 2011 Technical Sessions
（Texas, USA 19 Oct 2011）
As originally published in the SMTA International 2011 Conference Proceedings.
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The Effect of Microalloy Additions on the Morphology and Growth of Interfacial Intermetallic in Low-Ag and No-Ag Pb-Free Solders |
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International Conference on Electronics Packaging (ICEP) 2011
Japan Institute of Electronics Packaging (JIEP)
IEEE, CPMT Society Japan Chapter
(Nara, Japan 13-15 Apriｌ 2011) |
The Investigation of an Improved Tin-Zinc Solder for Practical Use
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| Announced in 2009 |
International Conference on Electronics Packaging (ICEP) 2009
Japan Institute of Electronics Packaging (JIEP)
IEEE, CPMT Society Japan Chapter
(Kyoto, Japan 14-16 Apriｌ 2009) |
Inhibition of Cracking in Cu6Sn5 intermetallic
Compound at Sn-Cu Lead-Free Solders and Cu Substrate Interfaces
Winning ICEP 2009 Outstanding Paper Award |
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|
Announced in 2008 |
SMTA International 2008
(Orlando, FL,USA 17-21 Augst 2008) |
Reliability Testing of Ni-Modified SnCu and SAC305 - Vibration |
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International Conference on Soldering and Reliability
(Tront Canada, 14-15 May 2008) |
Relationships Between the Impact Strength and Microstructure of Lead-Free Solders |
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ITRI Ltd’s and Metal Events Ltd’s International Tin Conference
(Hong Kong, 14-17April 2008) |
Lead-Free Solder Formulation: You need tin, but do you need silver? |
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APEX 2008
(Las Vegas, NV,USA , 1-3 April 2008) |
Properties That are Important in Lead-Free Solders |
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IPC/JEDEC International Conference on Reliability, Rework,
and Repair of Lead -Free Electronics
(Raleigh N.C., USA. 11-12 March, 2008) |
Accelerated Reliability Testing of Ni-Modified SnCu and SAC305 |
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Pan Pacific Microelectronics Symposium
（Kauai, Hawaii 23 January 2008)
"As originally published in the 2008 Pan Pacific Microelectronics Symposium Conference Proceedings."
|
Strength of Lead-Free BGA Spheres in High Speed Shear
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| Announced in 2007 |
IPC/JEDEC Global Conference on Lead Free Reliability and
Reliability Testing for RoHS Lead Free Electronics
(Austin Texas, USA. 3-5 December, 2007) |
Impact Strength of Lead-free BGA Spheres |
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Journal of ELECTRONIC MATERIALS
(DOI: 10.1007/s1 1664-007-0248-8)
(c) 2007 TMS
（Pablished December 2007 ) |
The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys |
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Journal of ELECTRONIC MATERIALS
(DOI: 10.1007/s1 1664-007-0281-7)
(c) 2007 TMS
(Published December 2007) |
The Influence of 0-0.1wt.% Ni on the Microstructure and Fluidity Length of
Sn-0.7Cu-xNi |
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IPC WORKS ASIA 2007
(Shenzhen, China 16 October, 2007) |
High Reliability Lead-free Solder
SN100C(Sn-0.7Cu-0.05Ni+Ge) |
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APEX 2007
(Annaheim, USA. 20-22 February, 2007) |
Measuring the True Wetting Time of Solders |
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| Announced in 2006 |
IPC/JEDEC International Conference on Lead Free Electronics Components and Assemblies- “RoHS Compliance and Beyond“
(Boston, USA. 6 December, 2006) |
Reliability of Tin/Copper/Nickel Lead-Free Wave Soldering |
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TPCA Exhibition & Conference
(Taipei, Taiwan. 17-20 October, 2006) |
The Advantages of The Ni-modified Sn-Cu Eutectic Solder as a Lead-free Hot Air Leveled Printed Circuit Board Finish |
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SMTA International Conference
(Chicago, USA. 24-29 September, 2006) |
Solidification Behaviour of Lead-Free Alloys and its Relationships to Their Performance as Practical Solders |
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| Scripta MATERIALIA 2006 (May) 54 Issue 9 Page
1557-1562 |
A rheological assessment of the effect of trace level Ni additions
on the solidification of Sn-0.7Cu
|
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International Conference on Lead Free Soldering
(Toronto, Canada 16 – 18 May, 2006) |
Advances in the Understanding of the Behaviour of the Ni-Modified Sn-Cu Eutectic as a Lead-free Solder |
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IPC/Soldertec 4th International Conference on Lead Free Electronics
(Malmo, Sweden. 25-27 April, 2006) |
Solidification Behaviour of the Ni-modified Sn-0.7Cu Eutectic |
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APEX 2006
Annaheim, USA. 5-10 February, 2006 |
The Fluidity of the Ni-Modified Sn-Cu Eutectic Lead-free Solder |
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| Announced in 2005 |
Materials Transactions Vol.46, No.11(2005)pp2419-2425
(Published November 15,2005) |
Microstructure Control in Sn-0.7mass%Cu Alloys |
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SMTA International Conference
(Chicago, USA. 25-29 September, 2005) |
Intermetallic Growth on HASL Substrates |
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IPC/JEDEC 9th International Conference on Lead Free
(Singapore, August 17-19, 2005) |
An Alternative Lead Free Electronics Assembly Technology |
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Brasage 2005
(Brest, France. 15-17 June, 2005) |
Developments in the Understanding of the Ni-modified Sn-Cu Eutectic as the Basis for a Reliable Lead-free Solder |
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IPC/JEDEC 3rd International Conference on Lead Free Electronics “Towards the RoHS Directive“
(Barcelona, Spain. 8-9 June, 2005) |
A Database for the Transition to Lead-free |
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International Conference on Lead Free Soldering
(Toronto, Canada. 24-26 May, 2005) |
A Eutectic Alloy for Lead-free Soldering |
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APEX 2005
(Anaheim, USA. 22-24 February, 2005) |
The Effect of Ni on the Microstructure and Behaviour of the Sn-Cu Eutectic Lead-free Solder |
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