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Technical Information

Presented paper
Announced in 2012

Pan Pacific Microelectronics Symposium
(Kauai, Hawaii 14 - 16 Feb 2012)
As originally published in the Pan Pacific Microelectronics Symposium 2012 Conference Programs

Pushing the Limits of Lead-Free Soldering DOWNLOAD ABSTRACT
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The Stability of Cu6Sn5 in the Formation and Performance of Lead-free Solder Joints DOWNLOAD ABSTRACT
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Tin-Copper-Nickel-Germanium, A Case Study in Lead-Free Implementation DOWNLOAD ABSTRACT
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Announced in 2011

SMTAI 2011 Technical Sessions
(Texas, USA 19 Oct 2011)
As originally published in the SMTA International 2011 Conference Proceedings.

The Effect of Microalloy Additions on the Morphology and Growth of Interfacial Intermetallic in Low-Ag and No-Ag Pb-Free Solders DOWNLOAD PAPER
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International Conference on Electronics Packaging (ICEP) 2011
Japan Institute of Electronics Packaging (JIEP)
IEEE, CPMT Society Japan Chapter
(Nara, Japan 13-15 April 2011)
The Investigation of an Improved Tin-Zinc Solder for Practical Use 
DOWNLOAD ABSTRACT
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Announced in 2009
International Conference on Electronics Packaging (ICEP) 2009
Japan Institute of Electronics Packaging (JIEP)
IEEE, CPMT Society Japan Chapter
(Kyoto, Japan 14-16 April 2009)
Inhibition of Cracking in Cu6Sn5 intermetallic Compound at Sn-Cu Lead-Free Solders and Cu Substrate Interfaces  
Winning ICEP 2009 Outstanding Paper Award
DOWNLOAD PAPER
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Announced in 2008
SMTA International 2008
(Orlando, FL,USA 17-21 Augst 2008)
Reliability Testing of Ni-Modified SnCu and SAC305 - Vibration DOWNLOAD ABSTRACTPDF
International Conference on Soldering and Reliability
(Tront Canada, 14-15 May 2008)
Relationships Between the Impact Strength and Microstructure of Lead-Free Solders DOWNLOAD ABSTRACTPDF
ITRI Ltd’s and Metal Events Ltd’s International Tin Conference
(Hong Kong, 14-17April 2008)
Lead-Free Solder Formulation: You need tin, but do you need silver? DOWNLOAD ABSTRACTPDF
APEX 2008
(Las Vegas, NV,USA , 1-3 April 2008)
Properties That are Important in Lead-Free Solders DOWNLOAD ABSTRACTPDF
IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead -Free Electronics
(Raleigh N.C., USA. 11-12 March, 2008)
Accelerated Reliability Testing of Ni-Modified SnCu and SAC305 DOWNLOAD ABSTRACTPDF
Pan Pacific Microelectronics Symposium
(Kauai, Hawaii 23 January 2008)
"As originally published in the 2008 Pan Pacific Microelectronics Symposium Conference Proceedings."
Strength of Lead-Free BGA Spheres in High Speed Shear Loading DOWNLOAD PAPER
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Announced in 2007
IPC/JEDEC Global Conference on Lead Free Reliability and Reliability Testing for RoHS Lead Free Electronics
(Austin Texas, USA. 3-5 December, 2007)
Impact Strength of Lead-free BGA Spheres DOWNLOAD ABSTRACTPDF
Journal of ELECTRONIC MATERIALS
(DOI: 10.1007/s1 1664-007-0248-8)
(c) 2007 TMS
(Pablished December 2007 )
The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys DOWNLOAD ABSTRACTPDF
Journal of ELECTRONIC MATERIALS
(DOI: 10.1007/s1 1664-007-0281-7)
(c) 2007 TMS
(Published December 2007)
The Influence of 0-0.1wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-xNi DOWNLOAD ABSTRACTPDF
IPC WORKS ASIA 2007
(Shenzhen, China 16 October, 2007)
High Reliability Lead-free Solder SN100C(Sn-0.7Cu-0.05Ni+Ge) DOWNLOAD PAPER
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APEX 2007
(Annaheim, USA. 20-22 February, 2007)
Measuring the True Wetting Time of Solders DOWNLOAD ABSTRACTPDF
Announced in 2006
IPC/JEDEC International Conference on Lead Free Electronics Components and Assemblies- “RoHS Compliance and Beyond“
(Boston, USA. 6 December, 2006)
Reliability of Tin/Copper/Nickel Lead-Free Wave Soldering DOWNLOAD ABSTRACTPDF
TPCA Exhibition & Conference
(Taipei, Taiwan. 17-20 October, 2006)
The Advantages of The Ni-modified Sn-Cu Eutectic Solder as a Lead-free Hot Air Leveled Printed Circuit Board Finish DOWNLOAD ABSTRACTPDF
SMTA International Conference
(Chicago, USA. 24-29 September, 2006)
Solidification Behaviour of Lead-Free Alloys and its Relationships to Their Performance as Practical Solders DOWNLOAD ABSTRACTPDF
Scripta MATERIALIA 2006 (May) 54 Issue 9 Page  1557-1562 A rheological assessment of the effect of trace level Ni additions
on the solidification of Sn-0.7Cu
DOWNLOAD ABSTRACTPDF
International Conference on Lead Free Soldering
(Toronto, Canada 16 – 18 May, 2006)
Advances in the Understanding of the Behaviour of the Ni-Modified Sn-Cu Eutectic as a Lead-free Solder DOWNLOAD ABSTRACTPDF
IPC/Soldertec 4th International Conference on Lead Free Electronics
(Malmo, Sweden. 25-27 April, 2006)
Solidification Behaviour of the Ni-modified Sn-0.7Cu Eutectic DOWNLOAD ABSTRACTPDF
APEX 2006
Annaheim, USA. 5-10 February, 2006
The Fluidity of the Ni-Modified Sn-Cu Eutectic Lead-free Solder DOWNLOAD ABSTRACTPDF
Announced in 2005
Materials Transactions Vol.46, No.11(2005)pp2419-2425
(Published November 15,2005)
Microstructure Control in Sn-0.7mass%Cu Alloys DOWNLOAD ABSTRACTPDF
SMTA International Conference
(Chicago, USA. 25-29 September, 2005)
Intermetallic Growth on HASL Substrates DOWNLOAD ABSTRACTPDF
IPC/JEDEC 9th International Conference on Lead Free
(Singapore, August 17-19, 2005)
An Alternative Lead Free Electronics Assembly Technology DOWNLOAD ABSTRACTPDF
Brasage 2005
(Brest, France. 15-17 June, 2005)
Developments in the Understanding of the Ni-modified Sn-Cu Eutectic as the Basis for a Reliable Lead-free Solder DOWNLOAD ABSTRACTPDF
IPC/JEDEC 3rd International Conference on Lead Free Electronics “Towards the RoHS Directive“
(Barcelona, Spain. 8-9 June, 2005)
A Database for the Transition to Lead-free DOWNLOAD ABSTRACTPDF
International Conference on Lead Free Soldering
(Toronto, Canada. 24-26 May, 2005)
A Eutectic Alloy for Lead-free Soldering DOWNLOAD ABSTRACTPDF
APEX 2005
(Anaheim, USA. 22-24 February, 2005)
The Effect of Ni on the Microstructure and Behaviour of the Sn-Cu Eutectic Lead-free Solder DOWNLOAD ABSTRACTPDF

 

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