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| NSe Lead-Free Soldering | Download |
| SN100C (Sn-Cu-Ni+Ge) Effects of the addition of Nickel and Germanium |
Download |
| Properties of our most popular lead-free solders |
| Thermal Profile for SN100C (Wave-soldering) |
| Thermal Profile for SN100C P500 D4(Reflow-soldering) |
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Vibration testing of lead-free solder by JCAA/JG-PP
A key result of the JCAA/JG-PP study on the reliability of lead-free solders is that in vibration testing of wave soldered PDIP components Nihon Superior's SN100C (Sn-Cu-Ni+Ge) outperformed the 95.5Sn-3.9Ag-0.6Cu alloy as well as 63Sn-37Pb by a substantial margin. JCAA/JG-PP Project (Project No. S-01-EM-026). The vibration test results show significant differences. At the 20% cumulative failure rate, |
Test Report of the vibration testing is
available via the following link |
| Reference to Topics : 2009.05.12 Vibration Test Results of NASA Project Show Significant Differences 2007.08.28 SN100C Selected for New NASA/DoD Lead-free Project 2006.07.11 Ranked No. 1 in Vibration Testing |
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SN100C Excellent Resistance to Impact at Temperatures as low as -120℃! SN100C lead-free solder proved to be superior to Sn-37Pb and silver containing lead-free solders by retaining its fracture toughness to a temperature as low as -120℃ in the Charpy Impact Test. The Charpy Impact Test was performed with the temperature range of -195℃ to 100℃ on lead-free solders, Sn-5%Ag, Sn-4%Ag-0.5%Cu, Sn-3%Ag-0.5%Cu, Sn-0.7%Cu(Ni) known as SN100C, 99.99%Sn, and Sn-0.7%Cu as well as Sn-37Pb. It was found that Sn-0.7%Cu(Ni) (SN100C) resulted in superior impact resistance at low temperature, as low as -120℃, in comparison to Ag containing solders and Sn-37Pb. |
The results of the Charpy Impact Test were published by: |
| Reference to Topics : 2009.09.08 SN100C Excellent Resistance to Impact at Temperatures as low as -120℃! |
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