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| We have a wide variety of flux-Cored solder, a mix of metal alloy, flux and other elements, that we have put together to match every type of application. |
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| Table Showing the Properties of Flux |
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| Classification |
General Type |
No-Clean Highly Active
Type |
No-Clean Transparent Residue
Type |
| Flux Number |
101 |
203 |
010 |
011 |
020 |
210 |
110 |
110M |
110MS |
| Flux Type |
JIS Z
3283
Class A |
JIS Z
3283
Class B |
JIS Z
3283
Class AA |
JIS Z
3283
Class AA |
JIS Z
3283
Class AA |
JIS Z
3283
Class A |
JIS Z
3283
Class A |
JIS Z
3283
Class A |
JIS Z
3283
Class A |
Flux Content
(%) |
2.0 |
2.0 |
3.0 |
3.0 |
3.0 |
2.5 |
1.0 |
2.0 |
2.0 |
| Degree of Dryness |
Passed |
Passed |
Passed |
Passed |
Passed |
Passed |
Passed |
Passed |
Passed |
Halogen
Content (%) |
0.35
0.05 |
0.80
0.05 |
Less than
0.05 |
Less than
0.04 |
0 |
Less than
0.25 |
0.3
0.1 |
0.3
0.1 |
0.3
0.1 |
Copper Plate
Corrosion |
Passed |
Passed |
Passed |
Passed |
Passed |
Passed |
Passed |
Passed |
Passed |
Copper Mirror
Corrosion |
Passed |
- |
Passed |
Passed |
Passed |
- |
Passed |
Passed |
Passed |
| Silver Chromate Paper |
- |
- |
Passed |
Passed |
Passed |
- |
- |
- |
- |
Resistance to
Solubility
( m) |
 1000 |
500 |
2000 |
3000 |
1000 |
500 |
1000 |
1000 |
1000 |
Insulation
Resistance
(m) |
85 85%
RH comb pattern II |
1.0x
109 |
1.0x
109 |
1.0x
1010 |
1.0x
1010 |
1.0x
1013(1) |
1.0x
109 |
1.0x
109 |
1.0x
109 |
1.0x
109 |
| *Expansion Ratio (%) |
90 |
85 |
85 |
85 |
80(2) |
90 |
90 |
90 |
90 |
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* These values may differ due to the metal alloys/flux content and the diameter of the wire used.
For soldering robots the special flux content is 4%
(1)JIS-2-3197 1999 8.5.3
(2)Using an oxidized copper plate at 300 |
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This formula is designed so that the incidence of bridging is rare; likewise when the soldering iron is removed the formula retains its shape and does not form nubs that follow the tip of the iron. The resin contains elements that are dispersed when heated (by the soldering iron) in addition to constituents that group together when heated. After the solder is applied the resin settles and remains on the top of the solder. In this fashion, should you find that you need to solder a portion again, the top layer of resin allows you to perform the task simply and easily with the soldering iron alone. |
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Based upon a special plastic synthesis with a rapid coefficient of wetness, this formula possesses high electrical insulation resistance. Moreover, when solder is applied, flux dispersal, resin oxidization and fumes are minimal. |
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The RMA type formula is highly reliable, very workable and can be used for fine pitch applications. As RMA is a non-chlorine formula, dispersal is minimal. RMA also possesses excellent insulation properties. It is suitable for use with lead-free solder.
>> Lead-Free Solder eCore Series |
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Another highly reliable RMA type formula. In particular, dispersion, fumes and smoke are minimal. Is also suitable for use with lead-free solder.
>> Lead-Free Solder eCore Series |
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A non-halogen formula that is highly active. Displays clean solder shear and can be used on fine pitch pattern land applications. Is also suitable for use with lead-free solder.
>> Lead-Free Solder eCore Series |
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Another non-chlorine formula with a rapid coefficient of wetness. Dispersal is minimal, with little or no bridging or nub formation following the withdrawal of the soldering iron. This formula is planned to shorten the operational time required to complete a soldering task. Is also suitable for use with lead-free solder. |
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This formula reduces post-solder difficulties with inspections etc., by minimizing bridging, possessing excellent wetness properties and eliminating the majority of dross after the solder has been applied. Moreover, as flux dross is very reliable, this formula is suitable to be applied without the need for any washing.
#110: Low residue type
#110M: Suitable for robot-welding jobs
#110MS: Excellent anti-dispersal properties; resin is transparent which means that the outer appearance is pleasing to the eye |
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