Activity
Classificaion		Resin		Organic	Organic Acid			Inorganic Acid
Product code		NS-316 F-8	NS-316 F-7	NS-334	NS-30	NS-52	NS-45	NS-72	NS-22	NS-23	NS-65
Recommended Substrate		Copper				Alloy 42	Nickel	Ferrous alloys except stainless steel, aluminum		Stainless steel	Ferrous alloys
Recommended Application		Printed circuit board assembly, Cable harness termination		Hot-dip tinning of lead frames	Hot-dip tinning of lead frames, Cable harness termination	Hot-dip tinning of lead frames		Radiator plate		Joining stainless steel	adiator plate
Method of Use	Application	Dipping Brushing Spray fluxing	Dipping Brushing Spray fluxing Foam fluxing	Dipping Brushing Spray fluxing	Dipping, Brushing
	Soldering	Single wave soldering, dip soldering		Dip Soldering
Additional Information		Halide-free Precautions for Use When using MS-316 and/or NS-334 please be sure to control the concentration of the flux. (This is not necessary in the case of a spray-type flux) The colour may vary from batch to batch but this does not affect the performance of the flux			Use only purified water for dilution It is necessary to remove flux residues by washing in warm or room temperature water The colour may vary from batch to batch but this does affect the performance of the flux			Does not contain zinc chloride so suitable for use in electrical and electronics assembly Use only purified water for dilution It is necessary to remove flux resides by washing with warm or room temperature water The colour may vary from batch to batch but this does not affect the performance of the flux

The fluxes listed include low-residue no-clean, water soluble organic acid (suitable for electronics applications), water soluble inorganic acid (for general application).
For other types of flux, e.g. rosin-based and synthetic resin no-clean for printed circuit board assembly, flues for BGA and CSP attachment or rosin-based fluxes for lead-free soldering please refer to see the listed flux page.