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NS501A is a new type of unwashed liquid-type flux solder. When heat is applied to this product in the presence of activating materials and agents, chemical reactions occur and the residue dross stabilizes into polymerized thermoplastic.
This polymer plastic displays excellent flexibility and adhesion.
Also the compound has excellent moisture interception effectiveness, which will protect the circuit board after soldering. NS-501A is a highly reliable washless solder flux, setting new standards across the board. |
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Special Features
 When the flux is heated for soldering, a polymerization reaction occurs between the polymerized thermoplastic and organic acids (the activation agent), causing the residue
dross to stabilize into polymerized thermoplastic.
This polymer plastic membrane displays amazing flexibility and adhesion. This
product will not simply fall off the circuit board after it has been applied.
The
check pin is easily inserted and withdrawn, enabling checking without washing.
Additionally,
the compound (polymer plastic membrane) has excellent moisture interception effectiveness,
contributing to its excellent electrical properties that include high electrical
insulation.
Scientifically,
stable polymer plastic membrane does not corrode when exposed to water and high
temperatures.
It is
possible to coat directly onto the resin membrane.
The
performance is akin to that of an active rosin-based flux.
Foaming
and coating are possible with this formula, so conventional soldering-use equipment
can also be used. |
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| General Properties |
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| Items |
Sample Properties |
Test Method |
| State |
Low-Viscosity Colorless
Transparent
Liquid |
Observations |
| Color Tone |
1> |
Gardner
color standard |
| Specific Gravity |
0.940 0.002 |
20 |
| Solid Content |
110.5 WT% |
145 15
minutes |
| Dryness |
Pass |
JIS-Z-3197
6.2 |
| Halogen Content |
0.10.02 WT% |
JIS-Z-3197
6.5 |
| Solder Expansion |
More than 80% |
JIS-Z-3197
6.10 |
Resistance to Solubility
in Water ( m) |
More than 200m |
JIS-Z-3197
6.7 |
| Copper Plate Corrosion |
No corrosion |
JIS-Z-3197
6.6.1 |
| Copper Mirror Corrosion |
Pass |
JIS-Z-3197
6.6.2 |
Surface Insulation
Resistance
() |
Initial Value |
More than 1x1014 |
JIS-Z-3197
6.8
JIS
2 Standard circuit boards |
| After 96 hours |
More than 1x1013 |
| After 500 hours |
More than 1x1013 |
| After 1000 hours |
More than 1x1013 |
Electromigration
Test () |
Initial Value |
More than 1x1014 |
JIS-Z-3197
6.9
JIS
2 Standard circuit boards
100VDC
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| After 96 hours |
More than 1x1013 |
| After 500 hours |
More than 1x1013 |
| After 1000 hours |
More than 1x1013 |
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No migration |
| Solder Wetness |
Equivalent to RA type |
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| Flash Point |
32 /
121 |
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| Acid Number |
111
mgKOH/g |
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| Cleanliness |
Less than 2.2 NaCl/cm2 |
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| Special Dilutents |
NS-701 |
14kg Can |
| Notes |
Polymerized plastic |
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*Patented in Japan and U.S.A.
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Polymer Molecule Plastic No-Clean Flux |
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