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List of Products
Lead-Free Solder SN100C (Sn-Cu-Ni+Ge) |
100 pin 0.5mm pitch QFP Wave soldered with SN100C |
SN100C is being used in thousands of wave soldering machines around the world and has proved its reliability in products exposed to the most severe service environments.
- The trace addition of Ni means fewer shorts and no shrinkage defects.
- Ni-stabilized intermetallic layer inhibits copper erosion.
- Reliable in harsh environments.
- High ductility ensure long service life of joints subjected to cyclic strain.
- Formulated for minimal generation of dross.
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SN100C WORLD |
SN100CL for Hot Air Solder Leveling (HASL)(Sn-Cu-Ni+Ge) |
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- Excellent fluidity
- Bridge-free coating of the fine pitch circuitry
- Bright smooth and uniform coating
- Low copper erosion
- Formation of stable intermetallic layer
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SN100C WORLD |
SN100C3 & SN100C4 High Temperature Dipper and Tinning Solder |
High temperature dip soldering and tinning of copper wire, polyurethane coated wire and component terminations. For use at up to 400°C.
- SN100C3 and SN100C4 make it possible to carry out dip soldering and tinning operations with minimum copper erosion.
Reduction of copper erosionGraph
SN100C WORLD |
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