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SN100C series

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SN100C series

SN100C series
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Lead-Free Solder SN100C (Sn-Cu-Ni+Ge)

100 pin 0.5mm pitch QFP Wave soldered with SN100C

SN100C is being used in thousands of wave soldering machines around the world and has proved its reliability in products exposed to the most severe service environments.
  • The trace addition of Ni means fewer shorts and no shrinkage defects.
  • Ni-stabilized intermetallic layer inhibits copper erosion.
  • Reliable in harsh environments.
  • High ductility ensure long service life of joints subjected to cyclic strain.
  • Formulated for minimal generation of dross.

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SN100CL for Hot Air Solder Leveling (HASL)(Sn-Cu-Ni+Ge)

  • Excellent fluidity
  • Bridge-free coating of the fine pitch circuitry
  • Bright smooth and uniform coating
  • Low copper erosion
  • Formation of stable intermetallic layer

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SN100C3 & SN100C4 High Temperature Dipper and Tinning Solder

High temperature dip soldering and tinning of copper wire, polyurethane coated wire and component terminations. For use at up to 400°C.
  • SN100C3 and SN100C4 make it possible to carry out dip soldering and tinning operations with minimum copper erosion.

Reduction of copper erosionGraphReduction of copper erosionGraph


High Reliability Lead-Free Solder Preforms SN100C(Sn-Cu-Ni+Ge)

Suitable for micro-soldering
  • The finely dispersed microstructure of SN100C provides forming stability,
    even with very thin foil.

Solder Foil (1μm thickness) Mapping on Cross-section


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