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List of Products
Low Carbonizing SN100C(030) |
Time of start of carbonizing(sec.)
【Conditions】380℃ |
The flux-cored solder wire enables
fast soldering with less carbonizing of
soldering tips and less flux spatter providing
greater productivity than existing products.
- Less tip and pad carbonizing
- Less flux spatter
- Less cracking of flux residue
- Fast soldering
- Fast melting
- Good spread
- Fewer shrinkage defect, Reduced copper erosion, and Stable intermetalic layer (SN100C)
- Substantial cost advantage
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Download Brochure(Ultrafine Diameter)Updated Download MSDS |
Ultrafine Diameter Updated
 0.3mm pitch 40-pin connector
Good spread and good pull-back reults in fewer bridges |
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 Halogen-Free SN100C(040) (Sn-Cu-Ni+Ge)
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 Solder Appearance Directly After Tip Separation |
High Reliability Lead-free SN100C(Sn-0.7Cu-0.05Ni+Ge) solder with a core flux with a formulation that does not include F,Cl,Br,or I.
Good separation of the solder from the tip with consequent reduced incidence of icicles.
No whiskers observed aftert 1000 hours at 85℃/85%RH.
- Good separation of the solder from the tip with reduced incidence of icicles
- Reduced cracking of flux residue
- Fewer shrinkage defects, reduced copper erosion, stable intermetallic layer
- Substantial cost advantage
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Download MSDS |
Halogen-Free High Activity SN100C(044) (Sn-Cu-Ni+Ge) new ! |
 Soldering Speed Test
Average Ratio(280℃,330℃,380℃) |
The fast wetting and spread of SN100C (044) flux-cored solder wire makes it possible to complete a solder joint up to 30% faster than with previously available completely halogen-free flux-cored wire.
Excellent wetting and spread ensure high first pass yields.
Completely halogen-free. Does not contain F, Cl, Br or I.
- Fast soldering.
- Better wetting and spread than previous totally halogen-free products.
- Reduced cracking of flux residue.
- Since the solder alloy is SN100C there are fewer shrinkage defects, low copper erosion and a stable intermetallic layer.
- Cost effective.
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Download MSDS |
Low Spatter SN100C(510) (Sn-Cu-Ni+Ge) |
 Spattering Test
Spattering Rating 280℃ ～480℃
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This high reliability flux-cored solder wire generates very little spatter even with the high solder tip temperatures required to burnoff insulating enamel.
- Low flux spattering
- Minimal cracking of flux residue
- Can be used with soldering tip temperature of up to 480℃
- Low erosion of tip
- SN100C Alloy means reduced risk of copper erosion during soldering and slow growth of interfacial intermetallic layer in service
- Cost effective high temperature soldering
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Download MSDS |
High Perfomance SN100C(551CT) (Sn-Cu-Ni+Ge) new ! |
 Incidence of Icicles as a Function of Soldering Time
・Tip Temperature : 330℃、380℃
・Soldering Time:0.5～1.0sec.
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With sustained activity and good separation of the solder from the tip with a consequent reduced incidence of icicles, high reliability SN100C (551CT) is Ideal for sequential soldering and rework.
- Reduced incidence of icicles and less spattering means cost effective soldering.
- SN100C solder alloy means fewer shrinkage defects, low copper erosion and an intermetallic layer that is stable in elevated temperature service.
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Download MSDS |
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Features of SN100C(030)