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SN100C series

ePaste Solder Paste

eBall Solder Spheres

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eFlux Soldering Flux

Lead-Free Solder

eBall Solder Spheres

ePaste Solder Paste
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Impact Strength SN100C (Sn-Cu-Ni+Ge)

Solder spheres with excellent impact strength, suitable for BGA, CSP, MCM and high density fine pitch applications.
  • High ductility ensures high impact strength
  • Stable intermetallic compound
  • Slow growth of interfacial intermetallic

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SN96CI/SN97C (Sn-Ag-Cu)

SN100C・SN96CI・SN97C
"For DIA 0.1mm-0.9mm, use the compatible flux RM-5 for the optimum soldering"

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SN100C WORLD

 

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