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Please allow for the fact that the references to previous events are based on the information that was available at the time. Some of these references might not be available now.

topics News
2008.12.16 Nihon Superior to exhibit at INTERNEPCON JAPAN and CAR-ELE JAPAN 2009
2008.11.11 To exhibit at Semicon Japan 2008!
2008.10.27 Nihon Superior to Show New Ranges of SN100C Solder at SMTA Penang 2008
2008.10.27 Nihon Superior to Show New Ranges of SN100C Solder at IEMT 2008
2008.10.21 To show New Ranges of SN100C Solder at Bohai Electronics Week 2008
2008.10.21 Ultrafine SN100C Flux-Cored Solder Wire, and SN100C Solder Preforms Debut
2008.10.03 Nihon Superior to Show New Ranges of SN100C Solder at Mexitrónica 2008
2008.09.09 Nihon Superior to Show New Ranges of SN100C Solder at IPC Midwest 2008
2008.09.09 SN100C (510) Flux-Cored Solder Wire Doubles Soldering Iron Tip Life
2008.09.09 Introduction of High Reliability Lead-free Solder Paste “SN100CP500 D4” and Linear Profile
2008.08.22 Nihon Superior’s New NS-F850 Flux Wins a 2008 Global Technology Award
2008.07.24 Nihon Superior to Display New Range of SN100C at Nepcon South China
2008.07.24 Nihon Superior to Display Complete Range of SN100C at SMTAI 2008
2008.07.08 Halogen-Free Products
2008.06.06 Completely Halogen-Free Flux-Cored Solder Wire Introduced
2008.05.20 Completely Halogen-free Lead-free Solder Paste Introduced
2008.05.20 Nihon Superior to exhibit at Microelectronics Show 2008
2008.05.20 Nihon Superior Singapore Celebrates 20th Anniversary
2008.05.20 Nihon Superior Wins a 2008 EMAsia Innovation Award for SN100C
2008.04.25 BGA Spheres High Speed Impact Testing Results in 1.SCNG≧2.SP>3.SAC !
2008.04.25 Nihon Superior’s SN100C Wins 2008 SMT China Vision Award
2008.04.15 Nihon Superior to Present at the 2008 International Tin Conference
2008.04.04 Nihon Superior to attend 18th Shanghai International SMT Conference
2008.03.11 Another collaborative project with the University of Queensland
2008.03.06 Nihon Superior Impact Strength for BGA Lead-free Solder Spheres Paper to be presented at TMS Conference
2008.03.06 Nihon Superior and DfR Solutions LF Solder Reliability Paper to be Presented at IPC/JEDEC Conference
2008.02.19 Nihon Superior USA to Showcase SN100C at Houston SMTA Vendor Show
2008.02.19 Nihon Superior USA to Showcase SN100C at Dallas SMTA Vendor Show
2008.02.13 Nihon Superior USA to Showcase SN100C at IPC International Conference on Flexible Circuits 2008
2008.02.12 Nihon Superior to Introduce Complete Range of SN100C Soldering Materials at APEX 2008
2008.02.12 Nihon Superior (Shanghai) to Introduce Complete Range of SN100C at NEPCON CHINA
2008.02.08 Nihon Superior Paper on Lead-free Solder Properties at APEX 2008
2008.01.25 Nihon Superior USA to Showcase SN100C at Electronics West 2008
2008.01.08 Nihon Superior’s SN100C Wins Global Technology Award 2007
news TOPICS
2008.07.08Updates to NS-e Lead-Free Soldering Brochure
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