2012.1.24Updated Information No.13（20120124）

Nihon Superior's Website Updated Information in Jan 2012　 Update Content Categories Remarks Jan 24 2012 Headline News Please Visit Our Booth #3044 at APEX 2012 Top Page Updated Jan 24 2012 Nihon Superior Nihon Superior to Showcase the Newest Addition to the SN100C Pb-Free Solder Series at IPC/APEX 2012 Topics from News Release Jan 24 2012 Nihon Superior to Exhibit at Electronics For You Expo 2012 (EFYEXPO 2012) Topics from News Release Jan 24 2012 Nihon Superior’s President Tetsuro Nishimura to Present at the Pan Pacific Microelectronics Symposium Topics from News Release Jan 24 2012 Nihon Superior to Discuss Intermetallic Stability at the Pan Pacific Microelectronics Symposium Topics from News Release Jan 24 2012 Seminar TMS 2012 (2012.3.14) "The Effect of Composition on the Thickness Morphology and Growth of Interfacial Intermetallic in Pb-Free Solder" Keith Sweatman IPC APEX EXPO 2012 Technical Conference (2012.2.29) "Effect of Cooling Rate on the Intermetallic Layer in Solder Joints" Keith Sweatman Exhibition & Seminar Updated