HOME>Exhibition Schedule

Exhibition Schedule

Introducing exhibitions in which participation is scheduled, within Japan and overseas.
We hope to see you at the venues.

Exhibition Schedule
Exhibition Name Date held Venue Hall
IPC APEX EXPO 2012 2012 Feb.28-Mar.1 San Diego, USA San Diego Convention Center
BoothNo.3044
EFYEXPO 2012 Feb.16-18 New Delhi, India Pragati Maidan
BoothNo.B-74B
INTERNEPCON JAPAN 2012
Thank you for visiting our booth. 		2012 Jan.18-20 Tokyo, Japan Tokyo Big Sight
Booth No.East 30-13
       
Seminars Schedule
Seminar Name Date held Venue Hall
TMS2012
"The Effect of Composition on the Thickness Morphology and Growth of Interfacial Intermetallic in Pb-Free Solder"
Keith Sweatman 		2012 Mar.14 Florida, USA Walt Disney World Swan Resort
IPC APEX EXPO 2012
Technical Conference Session
"Effect of Cooling Rate on the Intermetallic Layer in Solder Joints"
Keith Sweatman
2012 Feb.29
9:00-10:00		 San Diego, USA San Diego Convention Center
Pan Pacific Microelectronics Symposium
Session TA1: Pb Free Advancements

"The Stability of Cu6 Sn5 in the Formation and Performance of Lead-free Solder Joints"
Keith Sweatman

"Tin-Copper-Nickel-Germanium, A Case Study in Lead-Free Implementation"
Tetsuro Nishimura

2012 Feb.14
9:30-12:30		 Hawaii, USA

Sheraton Poipu Resort
Kauai, Hawaii

Pan Pacific Microelectronics Symposium
SYMPOSIUM KEYNOTE II
"Pushing the Limits of Lead-Free Soldering"
Tetsuro Nishimura
2012 Feb.15
17:30-18:15
Return to Top of Page