| Exhibition Name |
Date held |
Venue |
Hall |
| JISSO PROTEC 2013 ( JPCA Show ) |
2013 Jun.5 -7 |
Tokyo, Japan |
Tokyo Big Sight |
electronica china 2013
Thank you for visiting our booth. |
2013 Mar.19-21 |
Shanghai, China |
Shanghai New International Expo Center |
IPC APEX EXPO 2013
Thank you for visiting our booth. |
2013 Feb.19-21 |
California, USA |
San Diego Convention Center |
INTERNEPCON JAPAN 2013
Thank you for visiting our booth. |
2013 Jan.16-18 |
Tokyo, Japan |
Tokyo Big Sight
Booth EAST 33-14 |
SMTA International Electronics Exhibition 2012
Thank you for visiting our booth. |
2012 Oct.16-17 |
Florida, USA |
Walt Disney World Dolphin
Booth No.405 |
Nepcon South China 2012
Thank you for visiting our booth. |
2012 Aug.28-30 |
Shenzhen, China |
Shenzhen
Convention & Exhibition Center
Booth No.1B20 |
IPCA INTERNATIONAL EXPO 2012
Thank you for visiting our booth. |
2012 Jul.25-27 |
Bangalore, India |
KTPO Trade Centre
Booth No.G2 |
JISSO PROTEC 2012 ( JPCA Show )
Thank you for visiting our booth. |
2012 Jun.13 -15 |
Tokyo, Japan |
Tokyo Big Sight
Booth No.4B-04 |
NEPCON China 2012
Thank you for visiting our booth. |
2012 Apr.25-27 |
Shanghai, China |
Shanghai World Expo
Convention & Exhibition Center
Booth No.1B 22 |
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Seminars
Schedule |
|
| Seminar Name |
Date held |
Venue |
Hall |
SMTA Pan Pacific 2013
「A Nano Silver Replacement
for High Lead Solders
in Semiconductor Junctions」
Keith Sweatman / Tetsuro Nishimura /
Teruo Komatsu
Thank you for attending our presentation.
| 2013 Jan.23
13:30-16:00 |
Hawaii, USA |
Makena Beach and Golf Resort
WP1 Advanced Materials |
INTERNEPCON JAPAN
Technical Conference Program
「The Properties and High Reliability
of Tin-Copper-Nickel Lead-Free Solder」
Tetsuro Nishimura
Thank you for attending our presentation.
| 2013 Jan.16
9:30-12:00 |
Tokyo, Japan |
Tokyo Big Sight
Program No. INJ-1 |
SMTA International Technical Session
Optimizing Solder Paste for Void Minimization with Vacume Reflow
Keith Sweatman / Tetsuro Nishimura /
Takashi Nozu
Thank you for attending our presentation.
| 2012 Oct. 17
4:00-5:30pm |
Florida, USA |
Walt Disney World Dolphin
Session SMT7
Asia 2 meeting room |
NPI (New Product Introduction) Presentation
SN100C P810 D4 Lead-Free Solder Paste
Voiding Reduction with Vacuum Reflow4
Mitsuhiro Kawahara
Thank you for attending our presentation.
| 2012 Jun. 13 |
Tokyo, Japan |
Tokyo Big Sight |
TMS2012
The Effect of Composition on the Thickness Morphology and Growth of Interfacial Intermetallic in Pb-Free Solder
Keith Sweatman
Thank you for attending our presentation.
| 2012 Mar.14 |
Florida, USA |
Walt Disney World Swan Resort |
