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介绍预定在国内、国外举行的展览会。
欢迎惠顾。展览会日程

展览会日程
展览会名称 举行日期 召开地 会场
IPC APEX EXPO 2012 2012 Feb.28-Mar.1 San Diego, USA San Diego Convention Center
BoothNo.3044
EFYEXPO 2012 Feb.16-18 New Delhi, India Pragati Maidan
BoothNo.B-74B
INTERNEPCON JAPAN 2012
感谢您参观我们的展台. 		2012 Jan.18-20 日本・东京 东京有明国际展览中心
Booth No.East 30-13
       
研讨会日程
研讨会名称 举行日期 召开地 会场
TMS2012
"The Effect of Composition on the Thickness Morphology and Growth of Interfacial Intermetallic in Pb-Free Solder"
Keith Sweatman		 2012 Mar.14 Florida, USA Walt Disney World Swan Resort
IPC APEX EXPO 2012
Technical Conference Session
"Effect of Cooling Rate on the Intermetallic Layer in Solder Joints"
Keith Sweatman
2012 Feb.29
9:00-10:00		 San Diego, USA San Diego Convention Center
Pan Pacific Microelectronics Symposium
Session TA1: Pb Free Advancements

"The Stability of Cu6 Sn5 in the Formation and Performance of Lead-free Solder Joints"
Keith Sweatman

"Tin-Copper-Nickel-Germanium, A Case Study in Lead-Free Implementation"
Tetsuro Nishimura

2012 Feb.14
9:30-12:30		 Hawaii, USA

Sheraton Poipu Resort
Kauai, Hawaii

Pan Pacific Microelectronics Symposium
SYMPOSIUM KEYNOTE II
"Pushing the Limits of Lead-Free Soldering"
Tetsuro Nishimura
2012 Feb.15
17:30-18:15
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